FUNCTION:

An automatic plane-mirror/grain AOI sorting device with high speed, high precision and high stability, which is used to pick the sliced wafer/wafer-like product fixed on the blue film for AOI inspection.

PARAMETERS:

◆ Device compatibility: Compatible with 4~12 inch products

◆ UPH: Over 2000-6000PCS (different configurations)

◆ Detection position: product front, bottom, side defect detection;

◆ Detection content: size, edge breakage, damage, scratches, dirt, cracks and other surface defects

◆ Connect with MES system to realize automatic interaction of materials, process parameters, machine status information, etc.

APPLICATION:

After cutting, it is fixed on the blue film 4-12 inch wafer, flat mirror, LED and other wafer processing products.

FUNCTION:

Realize Wafer turnover between Cassette, Canister and Canister.

PARAMETERS:

◆ OCR code reader.

◆ Wafer detection was carried out in Cassette.

◆ Can detect whether the paper, wafer, and greater than 1mm damage.

◆ The height sensor determines the wafer or paper height for precise material removal and placement.

◆ Wafer size: 4-8 inch wafer.

◆ Cassette to cassette 150wafers.

◆ Cassette <> canister 90wafers.

◆ Canister <> canister 70wafers.

APPLICATION:

Loading and unloading of 4-8 inch Wafer, repacking, etc.

FUNCTION:

The equipment is composed of automatic feeding system, transmission and positioning system, automatic measurement system, automatic sorting and blanking system, intelligent measurement and control system and computer data processing system, which can automatically measure the detection items required by customers, sort out qualified parts and unqualified parts according to the measured value of the workpiece, and can carry out statistical analysis on the measurement data.

PARAMETERS:

◆ Device compatibility: Products with length and width of 3mm~40mm

◆ Screening accuracy: +/-0.02mm

◆ UPH: 4000-20000PCS/H (different configurations)

◆ Detection position: Defect detection of multiple surfaces and angles of the product;

◆ Detection content: size, damage, missing corners, scratches, dirt, and other surface defects

APPLICATION:

Passive components, electronic components, hardware, plastic, silicone, rubber, etc.

FUNCTION:

Make composite robot with cooperative arm. It can automatically reach the specified point according to the program setting, automatically take and discharge materials, and efficiently meet the flexible logistics handling needs of fixed lines in the production workshop.

PARAMETERS:

◆ Control mode: Intelligent motion control system

◆ Communication mode: Wifi 2.4G/5G

◆ Travel speed (m/s) Rated negative: ≤1m/s

◆ Guidance mode: Laser laser SLAM navigation

◆ Navigation accuracy (position/Angle deviation) : 20mm/ 2

◆ Rated load (kg) : 300~600

◆ Application environment: can adapt to 100 level clean car technology

APPLICATION:

Semiconductor plant handling automation, dust-free workshop loading and unloading turnover application, production material handling, etc.