◆ ME Fixture

◆ TE Fixture

◆ Module

◆ Optical Carrier

◆ SMT Carrier

◆ MLB Carrier

TYPE:

Screw locking fixture, pre-folding fixture, disassembly fixture, waterproof fixture, positioning fixture, pasting fixture, pressure-maintaining fixture and other ME assembly full process fixture.

EXPERIENCE: 

We undertake 3-4 projects each year , with a total of 500 projects , more than 30,000 sets per year, and the peak delivery volume is about 10,000 sets per month.

TYPE:

◆ CNC mold frame, welding fixture, glue filling fixture, hanging fixture, etc.

◆ Assembly accuracy ≤ 0.02 mm (Parts precision ± 0.005 mm)

◆ Mainly assist mobile phone parts positioning and welding process

TYPE:

gripper module, RF fixture loading board, front and back mounting board, dispensing carrier steel sheet, combined welding fixture and other full MLB function loading boards.

FEATURES:

(Optical Carrier)

◆ Thin sheet structure design, 0.2mm ≤ monomer thickness ≤ 1mm

◆ The processing technology is complex and the processing accuracy is high: the dimensional accuracy of the cavity is ≤ 0.02mm, and the flatness is ≤ 0.05mm

◆ Processing stress requirement: The flatness change before and after overall baking and heating (230 ℃/2.5 hours) should not exceed 50um

Platform contact heating (175 ℃/60 seconds), the flatness change of the cover plate under heating state is not more than 50um

◆ Use magnetic materials and high temperature resistant magnets to achieve the fitting of the upper and lower covers

◆ High load-bearing accuracy and good stability

(SMT Carrier)

◆ The processing technology is complex and the processing accuracy is high: the cavity size accuracy is ≤0.02 mm , and the flatness is ≤0.05 mm

◆ High bearing accuracy and good stability

APPLICATION:

The 3C industry (mobile phones, wearables, tablets, laptops) carries components such as cameras or displays with PCBA attached

◆ Type: CNC mold frame, welding fixture, glue filling fixture, hanging fixture, etc.

◆ Assembly accuracy ≤ 0.0 2 mm (Parts precision ± 0.005 mm)

◆ Mainly assist mobile phone parts positioning and welding process

FEATURES:

◆ Mainly assist in the positioning and cutting of LED and OLED screens;

◆ The processing technology is complex and the processing accuracy is high: the cavity size accuracy is ≤0.0 2 mm, and the flatness is ≤0.0 3 mm;

◆ Precise cutting, accuracy ≤ 0.0 1 mm;

◆ The laminating roller adopts a self-developed special processing technology to ensure the laminating effect and the rolling life reaches 50w+ times;

◆ High bearing accuracy and good stability.

APPLICATION:

3C industry (mobile phones, wearables, tablets, notebooks) LED , OLED screen cutting and bonding.

FEATURES:

◆ Manual cover /manual and automatic, precise positioning and easy operation;

◆ Use imported gold-plated probes and anti-static materials (Torlon, PEI, PPS, PEEK);

◆ The pressure plate automatically adjusts the pressure on the IC to ensure uniform pressure. The probe has strong adaptive ability and can accurately contact ICs with residual balls and uneven solder balls;

◆ Use Pogopin module for connection. Pogopin module can adopt probe or spring structure;

◆ High test accuracy, good stability, simple operation and convenient maintenance.

PARAMETERS:

◆ The test life can reach 100K times ~ 1000K times;

◆ The test spacing can reach 0.2MM , 0.35MM , 0.4MM , 0.5MM , 0.6MM;

◆ Processing accuracy ≤ 0.01 mm.

APPLICATION:

3C industry (mobile phones, wearables, tablets, notebooks) cameras or displays come with Connect testing or lighting imaging.